After a couple of years of regular use, Samsung’s $400 Galaxy Ring will end up contributing to the growing e-waste problem. “The Galaxy Ring — and all smart rings like it — comes with a huge string attached,” writes iFixit in a blog post. “It’s 100% disposable, just like the AirPod-style Buds3 that Samsung just released. The culprit? The lithium ion batteries.” ZDNet reports: The problem is the battery, and how they have a finite lifespan. Usually that’s about 400 recharge cycles, and after that the batteries are finished. And if you can’t replace it, then it’s the end of the line for the gadget, and it’s tossed onto the e-waste pile. […]

iFixit is damning about this sort of tech. “There’s nothing wrong with simple but there is something wrong with unrepairable. Just like the Galaxy Buds3, the Galaxy Ring is a disposable tech accessory that isn’t designed to last more than two years.” And the bottom line is simple: “We can’t recommend buying disposable tech like this.” Here’s what iFixit’s Shahram Mokhtari had to say about the Galaxy Ring’s battery, after putting it through a CT scanner: On the right hand side of the ring is the faint outline of a lithium polymer battery pouch. There’s an inductive coil sitting right on top of the battery (the lines that look like a rectangular track) and another very similar inductive coil that’s parallel and slightly separated from the first. That second inductive coil is inside the charging case and works together with the inductive coil in the ring to recharge the battery inside the Galaxy Ring. Inductive charging is the only practical way to deliver power to a device that doesn’t have any ports. But there’s something else here that sticks out like a sore thumb … that is a press connector joining the battery to the rest of the board! This is a surprising use of space, why isn’t this directly soldered? Nobody is getting back in there to disconnect this thing!

We love press connectors, they’re easy to work with and make replacing batteries a sight easier than desoldering a half dozen wires. But this one is sealed into the device and serves no purpose in replacement or repair. Our best guess as to why it’s in the Galaxy Ring: The battery and wireless charging coil were made in one place, the circuit board somewhere else, and it all comes to a production line somewhere where the two need to be connected together quickly and cheaply. Hence the press connector. It’s not for your benefit, it’s for the manufacturers.

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At the Flash Memory Summit 2024 this week, NVM Express published the NVMe 2.1 specifications, which hope to enhance storage unification across AI, cloud, client, and enterprise. Phoronix’s Michael Larabel writes: New NVMe capabilities with the revised specifications include:

– Enabling live migration of PCIe NVMe controllers between NVM subsystems.
– New host-directed data placement for SSDs that simplifies ecosystem integration and is backwards compatible with previous NVMe specifications.
– Support for offloading some host processing to NVMe storage devices.
– A network boot mechanism for NVMe over Fabrics (NVMe-oF).
– Support for NVMe over Fabrics zoning.
– Ability to provide host management of encryption keys and highly granular encryption with Key Per I/O.
– Security enhancements such as support for TLS 1.3, a centralized authentication verification entity for DH-HMAC-CHAP, and post sanitization media verification.
– Management enhancements including support for high availability out-of-band management, management over I3C, out-of-band management asynchronous events and dynamic creation of exported NVM subsystems from underlying NVM subsystem physical resources. You can learn more about these updates at NVMExpress.org.

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Meta CEO Mark Zuckerberg said that it’s working on a finger tracking neural wristband that will be ready to ship “in the next few years.” UploadVR reports: Appearing on the Morning Brew Daily talk show on Friday, Mark Zuckerberg said “we’re actually kind of close to having something here that we’re going to have in a product in the next few years.” […] An entirely different approach to finger tracking is to sense the neural electrical signals passing through your wrist to your fingers from your brain, using a technique called electromyography (EMG). Theoretically this could have zero or even negative latency, perfect accuracy, work regardless of lighting conditions, and not be subject to occlusion. When discussing the technology in 2021 Reardon claimed that a recent breakthrough enabled decoding the activity of individual neurons for “almost infinite control over machines.” Occlusion-free finger tracking of this quality and reliability could enable precise control of complex interfaces with incredibly subtle movements of your hand resting on your lap, making it an ideal input method for headsets and AR glasses. […]

So how will this arrive in a Meta product? In early 2023 an internal Meta AR/VR hardware roadmap leaked to The Verge, revealing details about Quest 3, the existence of the headset now rumored to be called Quest 3 Lite, and the cancelation of the 2024 candidate for Quest Pro 2 in favor of a more ambitious but “way out” model. But this roadmap also mentioned that Meta was planning to release the neural wristband alongside the third generation Ray-Ban smartglasses in 2025 as the input method.

According to that roadmap, two models of the wristband will be offered at different price points – one with the neural input tech only and another that also has a display and camera to act as a smartwatch too. A second generation of the wristband will also apparently act as the input device for the true AR glasses Meta plans to launch in 2027. We should however note that this plan or the timeline may have changed in the year since.

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An anonymous reader shared this report from Reuters:

Nvidia is building a new business unit focused on designing bespoke chips for cloud computing firms and others, including advanced AI processors, nine sources familiar with its plans told Reuters. The dominant global designer and supplier of AI chips aims to capture a portion of an exploding market for custom AI chips and shield itself from the growing number of companies pursuing alternatives to its products.

The Santa Clara, California-based company controls about 80% of high-end AI chip market, a position that has sent its stock market value up 40% so far this year to $1.73 trillion after it more than tripled in 2023. Nvidia’s customers, which include ChatGPT creator OpenAI, Microsoft, Alphabet, and Meta Platforms, have raced to snap up the dwindling supply of its chips to compete in the fast-emerging generative AI sector. Its H100 and A100 chips serve as a generalized, all-purpose AI processor for many of those major customers. But the tech companies have started to develop their own internal chips for specific needs. Doing so helps reduce energy consumption, and potentially can shrink the cost and time to design.

Nvidia is now attempting to play a role in helping these companies develop custom AI chips that have flowed to rival firms such as Broadcom and Marvell Technology, said the sources, who declined to be identified because they were not authorized to speak publicly…
Nvidia moving into this territory has the potential to eat into Broadcom and Marvell sales.

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At CES 2024 this week, Micron demonstrated its next-gen LPCAMM2 memory modules based on LPDDR5X memory. Not only are they smaller and more powerful than traditional SODIMMs, they can be “serviced during the manufacturing process and upgraded by the user,” says Micron. Tom’s Hardware reports: Micron’s LPCAMM2 are industry-standard memory modules that will be available in 16 GB, 32 GB, and 64 GB capacities as well as with speed bins of up to a 9600 MT/s data transfer rate. These modules are designed to replace conventional SODIMMs as well as soldered-down LPDDR5X memory subsystem while offering the best of both worlds: flexibility, repairability, and upgradeability of modular memory solutions as well as high performance and low power consumption of mobile DRAM. Indeed, a Micron LPCAMM2 module is smaller than a traditional SODIMM despite the fact that it has a 128-bit memory interface and up to 64 GB of LPDDR5X memory onboard. Needless to say, the module is massively smaller than two SODIMM memory sticks that offer a 128-bit memory interface both in terms of height and in terms of physical footprint.

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More than a decade ago engineers at AMD “began toying with a radical idea,” remembers the New York Times. Instead of designing one big microprocessor, they “conceived of creating one from smaller chips that would be packaged tightly together to work like one electronic brain.”

But with “diminishing returns” from Moore’s Law, packaging smaller chips suddenly becomes more important. [Alternate URL here.] As much as 80% of microprocessors will be using these designs by 2027, according to an estimate from the market research firm Yole Group cited by the Times:

The concept, sometimes called chiplets, caught on in a big way, with AMD, Apple, Amazon, Tesla, IBM and Intel introducing such products. Chiplets rapidly gained traction because smaller chips are cheaper to make, while bundles of them can top the performance of any single slice of silicon. The strategy, based on advanced packaging technology, has since become an essential tool to enabling progress in semiconductors. And it represents one of the biggest shifts in years for an industry that drives innovations in fields like artificial intelligence, self-driving cars and military hardware. “Packaging is where the action is going to be,” said Subramanian Iyer, a professor of electrical and computer engineering at the University of California, Los Angeles, who helped pioneer the chiplet concept. “It’s happening because there is actually no other way.”

The catch is that such packaging, like making chips themselves, is overwhelmingly dominated by companies in Asia. Although the United States accounts for around 12 percent of global semiconductor production, American companies provide just 3 percent of chip packaging, according to IPC, a trade association. That issue has now landed chiplets in the middle of U.S. industrial policymaking. The CHIPS Act, a $52 billion subsidy package that passed last summer, was seen as President Biden’s move to reinvigorate domestic chip making by providing money to build more sophisticated factories called “fabs.” But part of it was also aimed at stoking advanced packaging factories in the United States to capture more of that essential process… The Commerce Department is now accepting applications for manufacturing grants from the CHIPS Act, including for chip packaging factories. It is also allocating funding to a research program specifically on advanced packaging…

Some chip packaging companies are moving quickly for the funding. One is Integra Technologies in Wichita, Kan., which announced plans for a $1.8 billion expansion there but said that was contingent on receiving federal subsidies. Amkor Technology, an Arizona packaging service that has most of its operations in Asia, also said it was talking to customers and government officials about a U.S. production presence… Packaging services still need others to supply the substrates that chiplets require to connect to circuit boards and one another… But the United States has no major makers of those substrates, which are primarily produced in Asia and evolved from technologies used in manufacturing circuit boards. Many U.S. companies have also left that business, another worry that industry groups hope will spur federal funding to help board suppliers start making substrates.

In March, Mr. Biden issued a determination that advanced packaging and domestic circuit board production were essential for national security, and announced $50 million in Defense Production Act funding for American and Canadian companies in those fields. Even with such subsidies, assembling all the elements required to reduce U.S. dependence on Asian companies “is a huge challenge,” said Andreas Olofsson, who ran a Defense Department research effort in the field before founding a packaging start-up called Zero ASIC. “You don’t have suppliers. You don’t have a work force. You don’t have equipment. You have to sort of start from scratch.”

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According to DigiTimes, TSMC will charge an extra 30% more for chips made in American than for chips made in Taiwan. Tom’s Hardware reports: TSMC has started discussions with customers about orders and pricing for both overseas plants, which are set to begin commercial production in late 2024. Industry insiders believe that prices of chips produced on TSMC’s N4 and N5 process technologies in the U.S. will be 20% — 30% higher than those in Taiwan, while older process chips produced in Japan’s Kumamoto facility on N28/N22 as well as N16/N12 nodes may cost 10% – 15% more than similar chips fabbed in Taiwan.

While American chip designers certainly won’t appreciate higher costs on chip production in the U.S., it is likely that they will make chips aimed at government and less price-sensitive applications in Arizona. Therefore, they should be able to pass those extra costs on to their customers without risking their competitive positions. Given the high construction and operational costs of fabs in Japan and the U.S., TSMC is going to pass those extra expenses on to customers to maintain its gross margin target of 53%.

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Researchers at the University of Minnesota report via Phys.Org: Biocomputing is typically done either with live cells or with non-living, enzyme-free molecules. Live cells can feed themselves and can heal, but it can be difficult to redirect cells from their ordinary functions toward computation. Non-living molecules solve some of the problems of live cells, but have weak output signals and are difficult to fine-tune and regulate. In new research published in Nature Communications, a team of researchers at the University of Minnesota has developed a platform for a third method of biocomputing: Trumpet, or Transcriptional RNA Universal Multi-Purpose GatE PlaTform.

Trumpet uses biological enzymes as catalysts for DNA-based molecular computing. Researchers performed logic gate operations, similar to operations done by all computers, in test tubes using DNA molecules. A positive gate connection resulted in a phosphorescent glow. The DNA creates a circuit, and a fluorescent RNA compound lights up when the circuit is completed, just like a lightbulb when a circuit board is tested.

The research team demonstrated that:

– The Trumpet platform has the simplicity of molecular biocomputing with added signal amplification and programmability.
– The platform is reliable for encoding all universal Boolean logic gates (NAND, NOT, NOR, AND, and OR), which are fundamental to programming languages.
– The logic gates can be stacked to build more complex circuits.

The team also developed a web-based tool facilitating the design of sequences for the Trumpet platform. “Trumpet is a non-living molecular platform, so we don’t have most of the problems of live cell engineering,” said co-author Kate Adamala, assistant professor in the College of Biological Sciences. “We don’t have to overcome evolutionary limitations against forcing cells to do things they don’t want to do. This also gives Trumpet more stability and reliability, with our logic gates avoiding the leakage problems of live cell operations.”

“It could make a lot of long-term neural implants possible. The applications could range from strictly medical, like healing damaged nerve connections or controlling prosthetics, to more sci-fi applications like entertainment or learning and augmented memory,” added Adamala.

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According to a new report by Dean McCarron of Mercury Research, the x86 processor market has just endured “the largest on-quarter and on-year declines in our 30-year history.” “Based on previously published third-party data, McCarron is also reasonably sure that the 2022 Q4 and full-year numbers represent the worst downturn in PC processor history,” adds Tom’s Hardware. From the report: The x86 processor downturn observed has been precipitated by the terrible twosome of lower demand and an inventory correction. This menacing pincer movement has resulted in 2022 unit shipments of 374 million processors (excluding ARM), a figure 21% lower than in 2021. Revenues were $65 billion, down 19 percent YoY. McCarron was keen to emphasize that Mercury’s gloomy stats about x86 shipments through 2022 do not necessarily directly correlate with x86 PC (processors) shipments to end users. Earlier, we mentioned that the two downward driving forces were inventory adjustments and a slowing of sales — but which played the most significant part in this x86 record slump?

The Mercury Research analyst explained, “Most of the downturn in shipments is blamed on excess inventory shipping in prior quarters impacting current sales.” A perfect storm is thus brewing as “CPU suppliers are also deliberately limiting shipments to help increase the rate of inventory consumption… [and] PC demand for processors is lower, and weakening macroeconomic concerns are driving PC OEMs to reduce their inventory as well.” Mercury also asserted that the trend is likely to continue through H1 2023. Its thoughts about the underlying inventory shenanigans should also be evidenced by upcoming financials from the major players in the next few months. […]

McCarron shines a glimmer of light in the wake of this gloom, reminding us that overall processor revenue was still higher in 2022 than any year before the 2020s began. Another ray of light shone on AMD, with its gains in server CPU share, one of the only segments which saw some growth in Q4 2022. Also, AMD gained market share in the shrinking desktop and laptop markets.

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The Verge reports “undeniable momentum” for Matter, the royalty-free interoperability standard that “allows smart home devices from any manufacturer to talk to other devices directly and locally with no need to use the cloud.”

“Matter was the buzzword throughout CES 2023 this year, with most companies even remotely connected to the smart home loudly discussing their Matter plans.”

The new smart home standard was featured in several keynotes and displayed prominently in smart home device makers’ booths as well as in Google, Amazon, and Samsung’s big, showy displays. More importantly, dozens of companies and manufacturers announced specific plans. Several companies said they would update entire product lines, while others announced new ones, sometimes with actual dates and prices. And Matter controllers have become a major thing, with at least four brand-new ones debuting at CES. Interestingly, nearly all of them have a dual or triple function, helping banish the specter of seemingly pointless white hubs stuck in your router closet….

Matter works over the protocols Thread, Wi-Fi, and ethernet and has been jointly developed by Apple, Google, Samsung, Amazon, and pretty much every other smart home brand you can name, big or small. If a device supports Matter, it will work locally with Amazon Alexa, Samsung SmartThings, Apple Home, Google Home, and any other smart home platform that supports Matter. It will also be controllable by any of the four voice assistants….

The big four have turned on Matter support on their platforms, but Amazon’s approach has been piecemeal, and aside from Apple, nobody supports onboarding devices to Matter on iOS yet.

However, that is shifting: at CES, Amazon announced a full rollout by spring, and Samsung’s Jaeyeon Jung told The Verge that Matter support is coming to its iOS app this month. There’s still no news on Matter support in Google Home’s iOS app. Then there’s the whole competing Thread network issue, although that sounds like it will be resolved sooner rather than later….

The Matter device drought should be over soon — although, judging by most of these ship dates, not until at least the second half of 2023.
“It’s also likely we’ll see dedicated bridges coming out that can bring Z-Wave and other products with proprietary protocols into Matter….”

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